Is This Too Much or Too Little Product?

[3browns]

I recently got a PC and pads and am trying to figure out the whole "how much product, which pad, how fast, thing".



The picture attached is what is left over from Optimum Polish II on a 4" LC white flat pad after I have made 4 section passes and lifted the pad off the surface.



View attachment 15534



View attachment 15535



While I am polishing it seems like I am starting to buff dry as I am getting a very small amount of dust and the "trail" behind the pad seems dry; but, as you can see when I stop the PC and lift it off the surface it leaves a spot of damp polish.



I know buffing dry causes marring and using too much product diminishes results.



Can anyone tell me if it is possible to be "buffing dry" if the pad is still this wet when I finish a section?



Chilly

 

[Setec Astronomy]

I only have the original OP but that looks like WAY WAY too much product. The original Optimum polishes spread very thin and (really, like most polishes) you didn't need to use very much at all, and you're almost buffing it until it disappears. Again, I haven't used the II but the stuff I have it's really almost impossible to get any dust, so :nixweiss

 

[3browns]

Setec



Thanks



I guess what is confusing me is that I am polishing first with Optimum Hyper Spray and I am using about the same amount of each product. The Hyper Spray seems to stay much more "moist" for lack of a better word. I realize they are two separate products, but as I said I am a beginner at power correction.



I will back off on the polish and see what happens.



Thanks again



Chilly