These three polishes are fairly new and getting some good reviews. The one thing that I find interesting is that people are saying these polishes are as aggressive as the pad you are using. For example you can use a cutting pad and remove defects or use a polishing or finishing pad and get a ready to wax finish. So you only need the one polish and some pads. Well all polishes are more aggressive with a cutting pad than they are with a polishing pad or finishing pad, this is nothing new. My concern is using these polishes often. Any polish that is aggressive enough to remove significant defects should not be used on a regular basis. It may finish nice similar to a super fine polish like FPI but it has much more bite if can remove defects and should only be used like you would use DACP or PI III RC. What do people who are using these three products think about this? How comfortable are you using these polishes on a regular basis as a pre wax prep like you would use FPI? FPI is so light you can use it often without risking your clear. DACP on the other hand should only be used when lighter polishes have been tried and couldn't cut it. These new polishes apparently do the job of both these polishes.