compare/contrast 3M FI-II fine cut VS. DACP

blackntan

New member
subject says it all....



I'm a big fine cut user, but have always wanted to try DACP.



I've just run out of fine cut, and am getting ready to order more. I use it as a starting product to remove major swirls and scratches. I always use it with the yellow PC pad, and it's pretty agressive and has never let me down.



What's DACP like in relation?? Would I like it better if i'll be using it for those purposes? Is there anything better than the both of em to use as a first step major swirl remover product?



Thanks
 
DACP will work really well with a polishing pad. I use the yellow Megs or the White CMA polishing pad to remove heavy marring or swirling.



I have recently been using megs #80 speed glaze as it has had really good reviews here and removes a lot of imperfections also.



As to your question, I think fine cut is a little more aggressive than #83(DACP) but DACP will remove most all of the major imperfections I have come across.



Hope this helps.
 
Montoya,



What exactly is it that you prefer? Does it fill better? does it cut better? Does it leave a better final shine?



Have you ever tried DACP? How's that compare??
 
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